OPA992 datasheet(8/74 Pages) TI2

8 / 74 page

5.4 Thermal Information for Single Channel

THERMAL METRIC(1)

OPA992, OPA992S

UNIT

DBV

(SOT-23)

DCK

(SC70)

5 PINS

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

185.4

166.9

198.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

83.9

94.1

°C/W

RθJB

Junction-to-board thermal resistance

52.5

47.1

45.3

°C/W

ψJT

Junction-to-top characterization parameter

25.4

25.9

16.9

°C/W

ψJB

Junction-to-board characterization parameter

52.1

47.0

45.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Thermal Information for Dual Channel

THERMAL METRIC(1)

OPA2992, OPA2992S

Unit

(SOIC)

DDF

(SOT-23)

DGK

(VSSOP)

DSG

(WSON)

(TSSOP)

RUG

(X2QFN)

8 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

131.0

149.6

174.2

74.8

183.4

131.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

73.0

85.3

65.9

93.6

72.4

52.9

°C/W

RθJB

Junction-to-board thermal resistance

74.5

68.6

95.9

42.1

114.0

62.0

°C/W

ψJT

Junction-to-top characterization parameter

25.0

7.9

11.0

3.8

12.1

1.1

°C/W

ψJB

Junction-to-board characterization

parameter

73.8

68.4

94.4

41.9

112.3

61.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

N/A

17.0

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.6 Thermal Information for Quad Channel

THERMAL METRIC(1)

OPA4992

UNIT

(SOIC)

(TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

99.0

118.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

55.1

47.0

°C/W

RθJB

Junction-to-board thermal resistance

54.8

61.9

°C/W

ψJT

Junction-to-top characterization parameter

16.7

5.5

°C/W

ψJB

Junction-to-board characterization parameter

54.4

61.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

OPA992, OPA2992, OPA4992

SBOSA10F – JUNE 2021 – REVISED MARCH 2024

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