4

PCM1753, PCM1754, PCM1755

SLES092E – APRIL 2003 – REVISED JULY 2019

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Product Folder Links: PCM1753 PCM1754 PCM1755

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Copyright © 2003–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-

maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

VCC

–0.3

6.5

V

Ground voltage differences

AGND, DGND

±0.1

V

Input voltage

–0.3

6.5

V

Input current (any pins except supplies)

±10

mA

Ambient temperature under bias

PCM1753, PCM1754

–40

85

°C

PCM1755

–25

85

Junction temperature

150

°C

Storage temperature, Tstg

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

7.3

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

4.5

5

5.5

V

TA

Operating temperature

PCM1753, PCM1754

–40

85

°C

PCM1755

–25

85

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

PCM175x

UNIT

DBQ (SSOP)

16 PINS

RθJA

Junction-to-ambient thermal resistance

104.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

53

°C/W

RθJB

Junction-to-board thermal resistance

46.9

°C/W

ψJT

Junction-to-top characterization parameter

10.3

°C/W

ψJB

Junction-to-board characterization parameter

46.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W