4.3 Thermal Information

THERMAL METRIC(1)

SNx4AC32

BQA

(WQFN)

D (SOIC)

DB (SSOP)

N (PDIP)

NS (SOP)

PW

(TSSOP)

UNIT

14 PINS

14 PINS

14 PINS

14 PINS

14 PINS

14 PINS

RθJA

Junction-to-ambient

thermal resistance

91.3

119.9

96

80

76

145.7

°C/W

RθJC(top)

Junction-to-case (top)

thermal resistance

99.4

—

—

—

—

—

°C/W

RθJB

Junction-to-board

thermal resistance

61.0

—

—

—

—

—

°C/W

ψJT

Junction-to-top

characterization parameter

14.5

—

—

—

—

—

°C/W

ψJB

Junction-to-board characterization

parameter

60.8

—

—

—

—

—

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

37.0

—

—

—

—

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

note.

4.4 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

TA = 25°C

SN54AC32

SN74AC32

UNIT

MIN

TYP

MAX

MIN

MAX

MIN

MAX

VOH

IOH = −50µA

3V

2.9

2.9

2.9

V

4.5V

4.4

4.4

4.4

5.5V

5.4

5.4

5.4

IOH = −12mA

3V

2.56

2.4

2.4

IOH = −24mA

4.5V

3.86

3.7

3.7

5.5V

4.86

4.7

4.7

IOH = −50mA(1)

5.5V

3.85

3.85

IOH = −75mA(1)

5.5V

VOL

IOL = 50 µA

3V

0.002

0.1

0.1

0.1

V

4.5V

0.001

0.1

0.1

0.1

5.5V

0.001

0.1

0.1

0.1

IOL = 12mA

3V

0.36

0.5

0.5

IOL = 24mA

4.5V

0.36

0.5

0.5

5.5V

0.36

0.5

0.5

IOL = 50mA(1)

5.5V

1.65

1.65

IOL = 75mA(1)

5.5V

II

A or B ports

VI = VCC or GND

5.5V

±0.1

±1

±1

µA

ICC

VI = VCC or

GND,

IO = 0

5.5V

2

40

40

µA

Ci

VI = VCC or GND

5V

2.6

pF

(1)

Not more than one output should be tested at a time, and the duration of the test should not exceed 2ms.

SN54AC32, SN74AC32

SCAS528H – AUGUST 1995 – REVISED APRIL 2025

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