5

THVD1500

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SLLSEY4A – JULY 2017 – REVISED NOVEMBER 2018

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(1)

The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

4.5

5.5

V

VI

Input voltage at any bus terminal(1)

-7

12

V

VIH

High-level input voltage (Driver, driver enable, and receiver enable

inputs)

2

VCC

V

VIL

Low-level input voltage (Driver, driver enable, and receiver enable

inputs)

0

0.8

V

VID

Differential input voltage

-12

12

V

IO

Output current, Driver

-60

60

mA

IOR

Output current, Receiver

-8

8

mA

RL

Differential load resistance

54

Ω

1/tUI

Signaling rate

500

kbps

TA

Operating ambient temperature

-40

125

°C

TJ

Junction temperature

-40

150

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

THVD1500

UNIT

D (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

130.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

72.8

°C/W

RθJB

Junction-to-board thermal resistance

73.6

°C/W

ψJT

Junction-to-top characterization parameter

25.0

°C/W

ψJB

Junction-to-board characterization parameter

72.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

NA

°C/W

TJ(TSD)

Thermal shut-down temperature

170

°C

6.5 Power Dissipation

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VALUE

UNIT

PD

Driver and receiver enabled,

VCC = 5.5 V, TJ = 150 °C,

50% duty cycle square wave at signaling

rate

Unterminated RL = 300 Ω,

CL = 50 pF (driver)

300 kbps

50

mW

RS-422 load RL = 100 Ω,

CL = 50 pF (driver)

300 kbps

110

mW

RS-485 load RL = 54 Ω,

CL = 50 pF (driver)

300 kbps

170

mW