TLV7041 datasheet(6/69 Pages) TI2

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5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage VS = VCC - VEE

–0.3

Input pins (IN+, IN-)(2)

VEE – 0.3

Current into Input pins (IN+, IN-)

±10

Output (OUT) (TLV703x)(3)

VEE – 0.3

VCC + 0.3

Output (OUT) (TLV704x)

VEE – 0.3

Output short-circuit duration(4)

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device

reliability.

(2)

Input terminals are diode-clamped to VEE. Input signals that can swing 0.3V below VEE must be current-limited to 10mA or less

(3)

Output maximum is (VCC + 0.3V) or 7V, whichever is less.

(4)

Short-circuit to ground, one comparator per package.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage VS = VCC – VEE

1.6

6.5

Supply voltage VS = VCC – VEE, TLV70x1L and TLV70x1S only

1.2

6.5

Input voltage range

VEE – 0.1

VCC + 0.1

Ambient temperature, TA

–40

125

°C

5.4 Thermal Information (Single)

THERMAL METRIC(1)

TLV7031/TLV7041 (Including L and S)

UNIT

DPW (X2SON)

DBV (SOT-23)

DCK (SC70)

5 PINS

RθJA

Junction-to-ambient thermal resistance

533.2

297.2

278.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

302.7

224.7

186.6

°C/W

RθJB

Junction-to-board thermal resistance

408.3

200.1

113.2

°C/W

ΨJT

Junction-to-top characterization parameter

71.5

141.2

82.3

°C/W

ΨJB

Junction-to-board characterization parameter

405.9

198.9

112.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

188.3

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TLV7031, TLV7032, TLV7041, TLV7042, TLV7034, TLV7044

SLVSE13J – SEPTEMBER 2017 – REVISED NOVEMBER 2024

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