TLV7041 datasheet(7/69 Pages) TI2

7 / 69 page

5.5 Thermal Information (Dual)

THERMAL METRIC(1)

TLV7032/TLV7042

UNIT

DGK (VSSOP)

DDF (SOT-23)

DSG (WSON)

8 PINS

RθJA

Junction-to-ambient thermal resistance

211.7

212.5

106.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

96.1

127.3

°C/W

RθJB

Junction-to-board thermal resistance

133.5

129.2

72.5

°C/W

ΨJT

Junction-to-top characterization parameter

28.3

25.8

16.8

°C/W

ΨJB

Junction-to-board characterization parameter

131.7

129.0

72.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

47.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.6 Thermal Information (Quad)

THERMAL METRIC(1)

TLV7034/44

UNIT

RTE (QFN)

PW (TSSOP)

16 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

65.4

131.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

70.2

60.5

°C/W

RθJB

Junction-to-board thermal resistance

40.5

74.1

°C/W

ΨJT

Junction-to-top characterization parameter

5.6

12.6

°C/W

ΨJB

Junction-to-board characterization parameter

40.5

73.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

24.1

n/a

°C/W

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TLV7031, TLV7032, TLV7041, TLV7042, TLV7034, TLV7044

SLVSE13J – SEPTEMBER 2017 – REVISED NOVEMBER 2024

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TLV7041 Datasheet(PDF) 7 Page - Texas Instruments

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