AD3530R datasheet(9/49 Pages) AD

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Data Sheet

AD3530/AD3530R

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 9 of 49

Table 6. Absolute Maximum Ratings

Parameter

Rating

VDD to GND

−0.3V to +6.5V

IOVDD to GND

−0.3V to +2.1V

VOUTn to GND

−0.3V to VDD + 0.3V

VREF1 to GND

−0.3V to VDD + 0.3V

Digital Input Voltage to GND

−0.3V to IOVDD + 0.3V

Temperature

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Absolute Maximum Junction Temperature

150°C

Reflow Soldering Peak Temperature, Pb-Free (J-

STD-020)

260°C

1 Configured as the reference input pin.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operation environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot, sealed enclosure. θJB is the junction

to board thermal resistance. θJC is the is the junction to case

thermal resistance. ᴪJT is the is the junction to top thermal charac-

terization parameter. ᴪJB is the is the junction to board thermal

characterization.

Table 7. Thermal Resistance

Package Type

θJA

θJB

θJC

ᴪJT

ᴪJB

Unit

CB-25-111

43.71 9.64

4.75

4.42

9.64

°C/W

CP-20-232

71.11

24.67 43.58 5.36

22.51 °C/W

1 Simulation values on JEDEC 2S2P board with 4 thermal vias, still air (0m/sec

airflow).

2 Simulation values on JEDEC 2S2P board without thermal via due to absence

of exposed paddle, still air (0m/sec airflow).

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged

devices and circuit boards can discharge without detection.

Although this product features patented or proprietary protec-

tion circuitry, damage may occur on devices subjected to high

energy ESD. Therefore, proper ESD precautions should be

taken to avoid performance degradation or loss of functionality.

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