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TMUX1208, TMUX1209

www.ti.com

SCDS389C – AUGUST 2018 – REVISED DECEMBER 2018

Product Folder Links: TMUX1208 TMUX1209

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Copyright © 2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3)

All voltages are with respect to ground, unless otherwise specified.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VDD

Supply voltage

–0.3

6

V

VSEL or VEN

Logic control input pin voltage (EN, A0, A1, A2)

–0.3

6

V

ISEL or IEN

Logic control input pin current (EN, A0, A1, A2)

–30

30

mA

VS or VD

Source or drain voltage (Sx, D)

–0.5

VDD+0.5

V

IS or ID (CONT)

Source or drain continuous current (Sx, D)

–30

30

mA

Tstg

Storage temperature

–65

150

°C

TJ

Junction temperature

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per

ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±750

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

Supply voltage

1.08

5.5

V

VS or VD

Signal path input/output voltage (source or drain pin) (Sx, D)

0

VDD

V

VSEL or

VEN

Logic control input pin voltage (EN, A0, A1, A2)

0

5.5

V

TA

Ambient temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC

TMUX1208 / TMUX1209

UNIT

PW (TSSOP)

RSV (QFN)

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

118.9

134.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

49.3

74.3

°C/W

RθJB

Junction-to-board thermal resistance

65.2

62.8

°C/W

ΨJT

Junction-to-top characterization parameter

7.6

4.3

°C/W

ΨJB

Junction-to-board characterization parameter

64.6

61.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W