TMUX1308 datasheet(6/46 Pages) TI2

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Table 6-2. Pin Functions TMUX1309

TYPE(1)

DESCRIPTION(2)

NAME

NO.

S0B

I/O

Source pin 0 of mux B. Can be an input or output.

S2B

I/O

Source pin 2 of mux B. Can be an input or output.

I/O

Drain pin (Common) of mux B. Can be an input or output.

S3B

I/O

Source pin 3 of mux B. Can be an input or output.

S1B

I/O

Source pin 1 of mux B. Can be an input or output.

Active low logic input. When this pin is high, all switches are turned off. When this pin is low, the A[1:0]

address inputs determine which switch is turned on.

N.C.

Not Connected

Not internally connected.

GND

Ground (0 V) reference

Address line 1. Controls the switch configuration as listed in Table 9-2.

Address line 0. Controls the switch configuration as listed in Table 9-2.

S3A

I/O

Source pin 3 of mux A. Can be an input or output.

S0A

I/O

Source pin 0 of mux A. Can be an input or output.

I/O

Drain pin (Common) of mux A. Can be an input or output.

S1A

I/O

Source pin 1 of mux A. Can be an input or output.

S2A

I/O

Source pin 2 of mux A. Can be an input or output.

VDD

Positive power supply. This pin is the most positive power-supply potential. For reliable operation,

connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.

Thermal pad

—

Exposed thermal pad with conductive die attached. No requirement to solder this pad. If connected,

then it should be left floating or tied to GND.

(1)

I = input, O = output, I/O = input and output, P = power.

(2)

For what to do with unused pins, refer to Section 9.4.

TMUX1308, TMUX1309

SCDS426E – MARCH 2020 – REVISED OCTOBER 2022

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