8 Device and Documentation Support

8.1 Device Support

8.1.1 Device Nomenclature

Device Information(1)

PRODUCT

VOUT (2)

TPS714xxyyyz

XX is nominal output voltage (for example 33 = 3.3 V, 01 = adjustable).

YYY is package designator.

Z is package quantity.

TPS714xxyyyz M3

xx is nominal output voltage (for example 33 = 3.3V, 01 = adjustable)

yyy is package designator

z is package quantity

M3 is a suffix designator for new chip redesigns on the latest TI process

technology.

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Custom output voltages are available on a quick-turn basis for prototyping. Production quantities are available; minimum package

order quantities apply. Contact factory for details and availability.

8.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

8.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

TPS714

SBVS116D – DECEMBER 2008 – REVISED NOVEMBER 2023

www.ti.com

22

Submit Document Feedback

Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: TPS714