1

2

3

6

5

4

GND PLANE

R1

Cff

COUT

CIN

R2

RPG

Signal to Pin1

25

TPS746

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SBVS337A – APRIL 2018 – REVISED DECEMBER 2018

Product Folder Links: TPS746

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9 Power Supply Recommendations

Connect a low output impedance power supply directly to the IN pin of the TPS746.

10 Layout

10.1 Layout Guidelines

•

Place input and output capacitors as close to the device as possible.

•

Use copper planes for device connections in order to optimize thermal performance.

•

Place thermal vias around the device to distribute heat.

•

Do not place a thermal via directly beneath the thermal pad of the DRV package. A via can wick solder or

solder paste away from the thermal pad joint during the soldering process, leading to a compromised solder

joint on the thermal pad.

10.2 Layout Example

Figure 52. Layout Example for the DRV Package