6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Voltage(2)

IN

–0.3

7.0

V

EN

–0.3

VIN + 0.3

V

OUT

–0.3

VIN + 0.3

V

Current

OUT

Internally limited

mA

Temperature

Operating virtual junction, TJ

–55

150

°C

Storage, Tstg

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltages are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage(1)

2.7

6.5

V

IOUT

Output current

0.5

200

mA

TJ

Operating junction temperature

–40

125

°C

(1)

Minimum VIN = VOUT + VDO or 2.7 V, whichever is greater.

6.4 Thermal Information

THERMAL METRIC(1)

TPS799

UNIT

DDC

(SOT-23-THIN)

DRV

(WSON)

YZU

(DSBGA)

5 PINS

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

225.3

74.2

143.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

39.3

58.8

1.1

°C/W

RθJB

Junction-to-board thermal resistance

47.3

145.9

84.7

°C/W

ψJT

Junction-to-top characterization parameter

0.5

0.2

3.8

°C/W

ψJB

Junction-to-board characterization parameter

46.7

54.4

84.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

7.2

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TPS799

SBVS056L – JANUARY 2005 – REVISED FEBRUARY 2022

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