www.ti.com

PACKAGE OUTLINE

C

40X

0.25

0.15

40X

0.5

0.3

0.8 MAX

(0.2) TYP

0.05

0.00

36X 0.4

2X

3.6

2X 3.6

3.15 0.1

A

5.1

4.9

B

5.1

4.9

WQFN - 0.8 mm max height

RSB0040E

PLASTIC QUAD FLATPACK - NO LEAD

4219096/A 11/2017

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

10

21

30

11

20

40

31

(OPTIONAL)

PIN 1 ID

0.1

C A B

0.05

EXPOSED

THERMAL PAD

41

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 2.700