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EXAMPLE STENCIL DESIGN

8X (1.45)

8X (0.3)

6X (0.65)

(4.4)

(1.35)

(1.65)

BASED ON

0.125 THICK

STENCIL

(R0.05) TYP

4224944/B 11/2024

PowerPAD

HVSSOP - 1.1 mm max height

DGR0008A

PLASTIC SMALL OUTLINE

1.14 X 1.39

0.175

1.23 X 1.51

0.150

1.35 X 1.65 (SHOWN)

0.125

1.51 X 1.84

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

10. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:15X

SYMM

SYMM

1

4

5

8

BASED ON

0.125 THICK

STENCIL

BY SOLDER MASK

METAL COVERED

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES