ISO7740 datasheet(7/55 Pages) TI2

7 / 55 page

5.4 Thermal Information

THERMAL METRIC(1)

ISO774x-Q1

UNIT

DWW (SOIC)

DW (SOIC)

DBQ (QSOP)

16 PINS

RθJA

Junction-to-ambient thermal resistance

58.3

83.4

109

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

21.4

54.4

°C/W

RθJB

Junction-to-board thermal resistance

30.5

51.9

°C/W

ψJT

Junction-to-top characterization parameter

7.1

19.1

14.2

°C/W

ψJB

Junction-to-board characterization parameter

29.8

47.5

51.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see theSemiconductor and IC Package Thermal Metrics application

note.

5.5 Power Ratings

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO7740-Q1

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 50-MHz 50% duty cycle

square wave

210

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

165

ISO7741-Q1

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 50-MHz 50% duty cycle

square wave

210

PD1

Maximum power dissipation (side-1)

PD2

Maximum power dissipation (side-2)

135

ISO7742-Q1

Maximum power dissipation (both sides)

VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL =

15 pF, Input a 50-MHz 50% duty cycle

square wave

210

PD1

Maximum power dissipation (side-1)

105

PD2

Maximum power dissipation (side-2)

105

www.ti.com

ISO7740-Q1, ISO7741-Q1, ISO7742-Q1

SLLSEU0G – NOVEMBER 2016 – REVISED OCTOBER 2024

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Product Folder Links: ISO7740-Q1 ISO7741-Q1 ISO7742-Q1

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