FPD3000 datasheet(2/3 Pages) FILTRONIC

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Specifications subject to change without notice

Filtronic Compound Semiconductors Ltd

Tel: +44 (0) 1325 301111

Fax: +44 (0) 1325 306177

Email: sales@filcs.com

Website: www.filtronic.com

Datasheet v3.0

FPD3000

ABSOLUTE MAXIMUM RATING

PARAMETER

SYMBOL

TEST CONDITIONS

ABSOLUTE MAXIMUM

Drain-Source Voltage

VDS

-3V < VGS < -0.5V

10V

Gate-Source Voltage

VGS

0V < VDS < +8V

-3V

Drain-Source Current

IDS

For VDS > 2V

IDss

Gate Current

Forward or reverse current

25mA

RF Input Power

Under any acceptable bias state

600mW

Channel Operating Temperature

TCH

Under any acceptable bias state

175°C

Storage Temperature

TSTG

Non-Operating Storage

-65°C to 150°C

Total Power Dissipation

PTOT

See De-Rating Note below

7.3W

Simultaneous Combination of Limits

2 or more Max. Limits

80%

Notes:

Ambient = 22°C unless otherwise noted; exceeding any one of these absolute maximum ratings may cause

permanent damage to the device

2Total Power Dissipation defined as: P

TOT ≡ (PDC + PIN) – POUT,

where PDC: DC Bias Power, PIN: RF Input Power, POUT: RF Output Power

3Total Power Dissipation to be de-rated as follows above 22

°C:

PTOT= 7.3 - (0.05W/°C) x THS

where THS= heatsink or ambient temperature above 22°C

Example: For a 85

°C carrier temperature: P

TOT = 7.3 - (0.05 x (85 – 22)) = 4.2W

4Users should avoid exceeding 80% of 2 or more Limits simultaneously

5 Thermal Resitivity specification assumes a Au/Sn eutectic die attach onto a Au-plated copper heatsink or rib.

6 Operating at absolute maximum VD continuously is not recommended. If operation at 10V is considered then

IDS must be reduced in order to keep the part within it's thermal power dissipation limits. Therefore VGS is

restricted to < -0.5V.

PAD LAYOUT:

Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of bond pad opening

PAD

DESCRIPTION

COORDINATES

(µm)

A1/A2/A3/A4

Gate Pads

125, 625/475/325/175

B1/B2/B3/B4

Drain Pads

375, 625/475/325/175

Source Pad

DIE SIZE

(

µm)

DIE THICKNESS (

µm)

MIN. BOND PAD OPENING

(

µm x µm )

470 x 830

75 x 60

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