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RF3802
Rev A6 DS050609
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Thermal Pad and Via Design
The DUT must be connected to the PCB backside ground through a low inductance, low thermal resistance path. The required
interface is achieved with the via pattern shown below for both low inductance as well as low thermal resistance. The footprint
provided below worked well on the RFMD 20mil thick Rogers 4350 PCB and also standard FR4. The vias are 8mil vias that are
partially plated through and are finished to 8mils±2mils with a minimum plating of 1.5mil. Failure to place these vias within
the DUT mounting area on the PCB in this prescribed manner may result in electrical performance and/or reliability degrada-
tion.
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