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66612 Datasheet(PDF) 2 Page - Alpha & Omega Semiconductors |
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66612 Datasheet(HTML) 2 Page - Alpha & Omega Semiconductors |
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2 / 6 page ![]() AONS66612 Symbol Min Typ Max Units BVDSS 60 V VDS=60V, VGS=0V 1 TJ=55°C 5 IGSS ±100 nA VGS(th) Gate Threshold Voltage 2.3 2.85 3.5 V 1.4 1.65 TJ=125°C 2.25 2.7 2.0 2.5 mΩ gFS 100 S VSD 0.67 1 V IS 120 A Ciss 5300 pF Coss 1500 pF Crss 50 pF Rg 0.4 0.9 1.4 Ω Qg(10V) 78 110 nC Qgs 20 nC Qgd 20 nC Qoss Output Charge VGS=0V, VDS=30V 92 nC tD(on) 18 ns tr 10 ns tD(off) 40 ns tf 13 ns trr 30 ns Qrr 135 nC APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO MAKE CHANGES TO PRODUCT SPECIFICATIONS WITHOUT NOTICE. IT IS THE RESPONSIBILITY OF THE CUSTOMER TO EVALUATE SUITABILITY OF THE PRODUCT FOR THEIR INTENDED APPLICATION. CUSTOMER SHALL COMPLY WITH APPLICABLE LEGAL REQUIREMENTS, INCLUDING ALL APPLICABLE EXPORT CONTROL RULES, REGULATIONS AND LIMITATIONS. AOS' products are provided subject to AOS' terms and conditions of sale which are set forth at: http://www.aosmd.com/terms_and_conditions_of_sale Body Diode Reverse Recovery Charge Body Diode Reverse Recovery Time IF=20A, di/dt=500A/ms Turn-Off DelayTime Turn-Off Fall Time VGS=10V, VDS=30V, RL=1.5W, RGEN=3W IF=20A, di/dt=500A/ms Turn-On Rise Time Gate Source Charge Gate Drain Charge SWITCHING PARAMETERS m Ω Gate-Body leakage current RDS(ON) IS=1A, VGS=0V VDS=VGS, ID=250mA VGS=6V, ID=20A Forward Transconductance VDS=5V, ID=20A Static Drain-Source On-Resistance Turn-On DelayTime Maximum Body-Diode Continuous Current Input Capacitance Diode Forward Voltage DYNAMIC PARAMETERS Reverse Transfer Capacitance VGS=0V, VDS=30V, f=1MHz Output Capacitance Gate resistance VGS=10V, VDS=30V, ID=20A Total Gate Charge f=1MHz Electrical Characteristics (TJ=25°C unless otherwise noted) STATIC PARAMETERS Parameter Conditions IDSS μA Zero Gate Voltage Drain Current Drain-Source Breakdown Voltage ID=250mA, VGS=0V VDS=0V, VGS=±20V VGS=10V, ID=20A A. The value of RqJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The Power dissipation P DSM is based on R qJA t≤ 10s and the maximum allowed junction temperature of 150 °C. The value in any given application depends on the user's specific board design. B. The power dissipation P D is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Single pulse width limited by junction temperature T J(MAX)=150°C. D. The RqJA is the sum of the thermal impedance from junction to case RqJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 ms pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of T J(MAX)=150°C. The SOA curve provides a single pulse rating. G. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. Rev.2.1: April 2023 www.aosmd.com Page 2 of 6 |
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