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RF2314
Rev A7 DS070730
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is 3
μinch
to 8
μinch Gold over 180μinch Nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested
for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly pro-
cesses. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 3mil expansion to accommodate solder mask registration clearance around all pads. The center-
grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be pro-
vided in the master data or requested from the PCB fabrication supplier.
A = 0.70 x 1.00 (mm) Typ.
Pin 1
Pin 5
A
A
A
A
A
0.95 (mm)
Typ.
1.90 (mm)
Typ.
2.60 (mm)
Figure 1. PCB Metal Land Pattern (Top View)
A = 0.90 x 1.20 (mm) Typ.
0.95 (mm)
Typ.
1.90 (mm)
Typ.
2.60 (mm)
A
A
A
A
A
Figure 2. PCB Solder Mask Pattern (Top View)
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