SiC641, SiC641A

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Vishay Siliconix

S19-0864-Rev. A, 21-Oct-2019

13

Document Number: 77191

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Step 7: Adding Thermal Relief Vias

1. Thermal relief Vias can be added on the VIN and GND

pads to utilize inner layers for high current and thermal

dissipation

2. To achieve better thermal performance, additional Vias

can be put on VIN plane and PGND plane

3. VSWH pad is a noise source and not recommended to put

Vias on this plane

4. 8 mil drill for pads and 10 mils drill for plane can be the

optional Via size with 40 mils pitch. The Vias on pad may

drain solder during assembly and cause assembly issue.

Please consult with the assembly house for guideline

Step 8: Ground Connection

1. It

is

recommended

to

make

single

connection

between AGND and PGND and this connection can be

done on top layer

2. It is recommended to make the whole inner 1 layer

(next to top layer) ground plane and separate them into

AGND and PGND plane

3. These ground planes provide shielding between noise

source on top layer and signal trace on bottom layer

V

IN plane

P

GND

plane

V

SWH

P

GND

V

IN

A

GND

V

SWH

P

GND

A

GND