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AD8017 Datasheet(PDF) 13 Page - Analog Devices |
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AD8017 Datasheet(HTML) 13 Page - Analog Devices |
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13 / 16 page ![]() AD8017 –13– REV. C The practical maximum value that these resistors can have is determined by the offset voltage that is created by the input bias current that flows through them. The maximum input bias current into the + inputs is 45 µA. This will create an offset voltage of 45 mV per 1 k Ω of bias resistor. Fortunately, the ac coupling of the stages provides only unity gain for this dc offset voltage, which is another advantage of this configuration. Any dc offset in the output will limit the amount of dynamic signal swing that will be available between the rails. The circuit shown uses two 4.7 V Zener diodes that provide a voltage drop which serves to limit the power dissipation in the bias circuit. This allows the use of smaller value resistors in the bias circuit. Thus, for this circuit the current will be (12 V – (2 × 4.7 V))/2 kΩ = 1.3 mA. Thus, this circuit will dissipate only 15.6 mW, yet only induce a maximum of 40 mV of offset at the output. This circuit will also track the midpoint of the supplies over their specified tolerance range. The distortion of the circuit was measured with a 50 Ω load. The frequency used was 500 kHz, which is beyond the maxi- mum required for the upstream signal. For ADSL over POTS, a maximum frequency of 135 kHz is required. For ADSL over ISDN, the maximum frequency is 276 kHz. The amplitude was 20 V p-p (10 V p-p for each amplifier), which is the maximum crest signal that will be required. The second harmonic was better than –80 dBc, while the third harmonic was –64 dBc. This represents a worst case of the absolute maximum signal that will be required for only a very small statistical basis and at a fre- quency that is higher than the maximum required. For a statisti- cal majority of the time, the signal will be at a lower amplitude and frequency, where the distortion performance will be better. When the circuit was run while providing the upstream drive signal in an ADSL system, the supply current to the part was mea- sured at 25 mA. Thus, the total power to the drive circuit was 300 mW. This power winds up in three places: the drive ampli- fier, down the line and in the termination and interface circuitry. The ADSL specification calls for 13 dBm or 20 mW into the line. The line termination will consume an equal amount of power, as it is the same resistance value. About a 1 dB loss can be expected in the losses in the interface circuitry, which translates into about 10 mW of power. Thus, the total power dissipated in the AD8017 when used as a driver in this application is about 250 mW. A1 A1 RL VO1 VO2 VCC VEE Figure 8. Differential Driver Simplified Circuit Schematic It is important to consider the total power dissipation of the AD8017 in order to properly size the heat sinking area for your application. The dc power dissipation for VIN = 0 is simply, IQ. (VCC + VEE), or 2 × I Q × V S. For the AD8017, this number is 0.17 W. In this purely differential circuit we can use symmetry to simplify the computation for a dc input signal, PI V V V V R DQ S S O O L =× × + × ()× 24 – This formula is slightly pessimistic due to the fact that some of the quiescent supply current commutates during sourcing or sinking current into the load. For a sine wave source, integration over a half cycle yields: PI V VV R V R DQ S OS L O L =× × + × − 22 4 2 π (Refer to Figure 41) The situation is more complicated with a complex modulated signal. In the case of a DMT signal, taking the equivalent sine wave power overestimates the power dissipation by > 15%. For example: POUT = 16 dBm = 40 mW VOUT @ 50 Ω = 1.41 V rms or V O = 1.0 V at each amplifier output, which yields a PD of 0.436 W. By actual measurement, PD for a DMT signal of 16 dBm requires 0.38 W of power to be dissipated by the AD8017. OUTPUT VOLTAGE (VO) – VPK 0.8 0 0.2 4 12 03 0.3 0.4 0.5 0.6 0.7 0.1 56 Figure 9. Power Dissipation (PD) vs. Output Voltage (VO), RL = 50 Ω Thermal Considerations The AD8017 in a “Thermal Coastline” SO-8 package relies on the device pins to assist in removing heat from the die at a faster rate than that of conventional packages. The effect is to provide a lower θJC for the device. To make the most effective use of this, special details should be worked into the copper traces of the printed circuit board. There will be a tradeoff, however, between designing a board that will maximally remove heat, and one that will provide the desired ac performance. This is the result of the additional para- sitic capacitance on some of the pins that would be caused by the addition of extra heat sinking copper traces. |
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