W144

Rev 1.0, November 21, 2006

Page 9 of 13

Stresses greater than those listed in this table may cause

permanent damage to the device. These represent a stress

rating only. Operation of the device at these or any other condi-

tions above those specified in the operating sections of this

specification is not implied. Maximum conditions for extended

periods may affect reliability.

Parameter

Description

Rating

Unit

Voltage on any pin with respect to GND

–0.5 to +7.0

V

Storage Temperature

–65 to +150

°C

Ambient Temperature under Bias

–55 to +125

°C

Operating Temperature

0 to +70

°C

Input ESD Protection

2 (min)

kV

Parameter

Description

Test Condition

Min.

Typ.

Max.

Unit

Supply Current

3.3V Supply Current

CPU_F, CPU1 = 100.2 MHz

–260

–

mA

2.5V Supply Current

CPU_F, CPU1 = 100.2 MHz

–25

–

mA

Logic Inputs

Input Low Voltage

GND –

0.3

–0.8

V

Input High Voltage

2.0

–

0.3

V

––

–25

A

––

10

A

Input Low Current (SEL100/66#)

–

–

–5

A

Input High Current (SEL100/66#)

–

–

+5

A

Clock Outputs

Output Low Voltage

–

–

50

mV

Output High Voltage

3.1

–

–

V

Output High Voltage

CPU_F,1,

IOAPIC

2.2

–

–

V

Output Low Current

27

57

97

mA

PCI_F, PCI1:5

20.5

53

139

mA

IOAPIC

40

85

140

mA

REF0:1

25

37

76

mA

48MHz

25

37

76

mA

24MHz

25

37

76

mA

Output High Current

25

55

97

mA

PCI_F, PCI1:5

31

55

139

mA

IOAPIC

40

87

155

mA

REF0:1

27

44

94

mA

48MHz

27

44

94

mA

24MHz

25

37

76

mA

Notes:

3. Multiple Supplies: The voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.

4. All clock outputs loaded with 6" 60

traces with 22-pF capacitors.

5. W144 logic inputs (except FS3) have internal pull-up devices (pull-ups not full CMOS level). Logic input FS3 has an internal pull-down device.