APA3010 datasheet(13/20 Pages) ANPEC

13 / 20 page

Rev. A.7 - Dec., 2010

www.anpec.com.tw

APA3010/1

Thermal Pad Consideration (Cont.)

Application Information (Cont.)

For good thermal conduction, the vias must be plated

through and solder filled. The copper plane used to con-

duct heat away from the thermal pad should be as large

as practical.

If the ambient temperature is higher than 25°C, a larger

copper plane or forced-air cooling will be required to keep

the APA3010/1 junction temperature below the thermal

shutdown temperature (150°C). In higher ambient

temperature, higher airflow rate and/or larger copper area

will be required to keep the IC out of thermal shutdown.

Thermal Consideration

Linear power amplifiers dissipate a significant amount of

heat in the package under normal operating conditions.

To calculate maximum ambient temperatures, refer the

“Power Dissipation vs. Output Power” graphs. Given

JA, the maximum allowable junction temperature (TJMAX),

and the total internal dissipation (P

D), the maximum am-

bient temperature can be calculated with the following

equation. The maximum recommended junction tem-

perature for the APA3010/1 is 150°C. The internal dissi-

pation figures are taken from the Power Dissipation vs.

Output Power graphs.

AMax = TJMax -θJAPD

(12)

150 - 50(1.3) = 85°C

The APA3010/1 is designed with a thermal shutdown pro-

tection that turns the device off when the junction tem-

perature surpasses 150°C to prevent damaging the IC.

0.65mm

1.0mm

2.5mm

Ground plane

for ThermalPAD

ThermalVia diameter

12mil X 5

MSOP-8P Land Pattern Recommendation

2.0mm

3mm

Ground plane for ThermalPAD

ThermalVia diameter

12mil X 15

0.25mm

SOP-8P Land Pattern Recommendation

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