MIC2975X datasheet(8/40 Pages) MICROCHIP

8 / 40 page

MIC2915X/30X/50X/75X

DS20005685A-page 8

 2016 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature Range

–65

—

+150

°C

—

Operating Junction Temperature

–40

—

+125

°C

—

Lead Temperature

—

+260

°C

Soldering, 5 sec.

Package Thermal Resistance

Thermal Resistance TO-220

θJC

—2

—

°C/W

—

Thermal Resistance TO-263

θJC

—2

—

°C/W

—

Thermal Resistance TO-247

θJC

—1.5

—

°C/W

—

Thermal Resistance TO-252

θJC

—3

—

°C/W

—

Thermal Resistance TO-252

θJA

—56

—

°C/W

—

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

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