(Voltages relative to ground.)

Voltage Range on VCC Pins.................................-0.5V to +4.0V

Voltage Range on All Other Pins

(not to exceed 4.0V)............................. -0.5V to (VCC + 0.5V)

Continuous Power Dissipation (TA = +70°C)

TQFP (derate 27.80mW/ºC above +70°C)...........2222.20mW

Operating Temperature Range........................... -40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range............................ -55°C to +125°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

ESD Protection (All Pins, Human Body Model) ..................±2kV

TQFP

Junction-to-Ambient Thermal Resistance (θJA) ..........36°C/W

Junction-to-Case Thermal Resistance (θJC).....................4°C/W

(Note 1)

(VCC = 2.3V to 3.6V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 3.0V and TA = +25°C.) (Notes 2, 3)

(TA = -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

VCC

2.3

3.0

3.6

V

Input Logic 1

(RST, CSW, SCK, DIN, CE)

VIH

VCC x 0.7

VCC + 0.3

V

Input Logic 0

(RST, CSW, SCK, DIN, CE)

VIL

-0.3

VCC x 0.3

V

Input Logic 1 (32KX1)

VIH32KX1

VCC x 0.85

VCC + 0.3

V

Input Logic 0 (32KX1)

VIL32KX1

-0.3

VCC x 0.15

V

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Input Leakage

(CSW, RST, SCK, DIN, CE)

IL

-0.1

+0.1

µA

Output Leakage

(INT, WDO, T1,T2,T3,T4)

-0.1

+0.1

µA

Output Voltage Low (32KOUT)

VOL32K

2mA

0.2 x VCC

V

Output Voltage High (32KOUT)

VOH32K

-1mA

0.8 x VCC

V

Output Voltage High

(DOUT, CMP_OUT/UP_DN)

VOH

-4mA

0.8 x VCC

V

Output Voltage High (TC)

VOHTC

VCC = 3.3V, IOUT = -4mA

2.9

3.1

V

MAX35101

Time-to-Digital Converter with Analog Front-End

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

Recommended Operating Conditions