2 ______________________________________________________________________________________

Boosted 2.2W Class D Amplifier

with Automatic Level Control

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

VBAT to AGND.........................................................-0.3V to +6V

VCCOUT to BSTPGND, AGND.................................-0.3V to +6V

PVDD to SPKPGND.................................................-0.3V to +6V

BSTPGND, SPKPGND to AGND ......................... -0.3V to +0.3V

GAIN to AGND ........................................ -0.3V to (VBAT + 0.3V)

SDBST, SDSPK to AGND........................................-0.3V to +6V

All Other Pins (excluding LX) to AGND ..................-0.3V to +6V

Current Into/Out of LX, VCCOUT, BSTPGND..................... Q3.9A

Continuous Current Into/Out of SPK_, PVDD,

SPKPGND.................................................................. Q800mA

Continuous Input Current (all other pins)........................ Q20mA

Duration of Short Circuit Between VCCOUT

and BSTPGND...................................................... Continuous

Duration of SPK_ Short Circuit to PVDD or

SPKPGND..............................................................Continuous

Duration of Short Circuit Between SPKP

and SPKN ..............................................................Continuous

Continuous Power Dissipation, Multilayer Board (TA = +70NC)

WLP (derate 20.4mW/NC above +70NC)........................1.33W

Junction Temperature .....................................................+150NC

Operating Temperature Range.......................... -40NC to +85NC

Storage Temperature Range............................ -65NC to +150NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

(VBAT = 3.6V, RL = J between SPKP and SPKN, AV = +6dB, CIN = 1FF, 20Hz to 22kHz AC measurement bandwidth, TA = TMIN to

TMAX, unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)

ABSOLUTE MAXIMUM RATINGS

WLP

Junction-to-Ambient Thermal Resistance (

qJA) ..........49°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Power-Supply Rejection Ratio

(Note 3)

PSRR

TA = +25NC, VBAT = 2.5V to 5.5V

95

dB

Quiescent Current

IVBAT

TA = +25NC, SDSPK = SDBST = VBAT

3.7

mA

TA = +25NC, VSDSPK = 0V, SDBST = VBAT

0.1

0.15

IPVDD

TA = +25NC, PVDD = 5.55V, SDSPK =

SDBST = VBAT

1.7

2.7

Combined Efficiency

E

POUT = 1.7W, f = 1kHz, ZSPK = 8I + 68FH

87

%

Shutdown Current

ISHDN

VSDSPK = VSDBST = 0V, TA = +25NC

0.04

1.5

F

A

Turn-On Time

tON

Time from power-on to full operation

10

12

ms

BOOST CONVERTER

Battery Supply Voltage Range

VBAT

2.5

5.5

V

Soft-Start Interval

tON

5.6

ms

Undervoltage Lockout

UVLO

VBAT falling

2.1

2.2

2.3

V

Boost Converter Output Voltage

VVCCOUT ILOAD = 0mA

5.45

5.5

5.65

V

Output Current Limit

IMAX

VBAT R = 3.6V

1.5

A

Input Current Limit

ILIMIT

Startup, VCCOUT = 0V

0.3

0.5

A

nMOS Current Limit

ILX,MAX

3.3

A

pMOS Turn-Off Current Limit

10

mA