Datasheet revision 1.1

www.chipquik.com

Thermally Stable Solder Paste No-Clean Sn42/Bi57.6/Ag0.4 T4 (15g Syringe)

Product Highlights

Revolutionary Formula: No Refrigeration Required!

Printing speeds up to 125mm/sec

Long stencil life

Wide process window

Clear residue

Low voiding

Excellent wetting compatibility on most board finishes

Dispense grade

Compatible with enclosed print heads

RoHS II and REACH compliant

Specifications

Alloy:

Sn42/Bi57.6/Ag0.4

Mesh Size:

T4

Micron (µm) Range:

20-38

Flux Type:

Synthetic No-Clean

Flux Classification:

ROL0

Metal Load:

87% Metal by Weight

Melting Point:

138°C (281°F)

Packaging:

5cc/15g Syringe

Shelf Life:

Refrigerated >12 months, Unrefrigerated >12 months *See notes below:

*Shelf Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually

inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product

thoroughly for 2-3 minutes before inspection and use.

Chip Quik® solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal

powder. Chip Quik® solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you

have any issues with our solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain

original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes.

Printer Operation

Print Speed: 25-125mm/sec

Squeegee Pressure: 70-250g/cm of blade

Under Stencil Wipe: Once every 10-25 prints, or as necessary

Stencil Life

>12 hours @ 20-50% RH 22-28°C (72-82°F)

>4 hours @ 50-70% RH 22-28°C (72-82°F)

Stencil Cleaning

Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling

Store at room temperature 20-25°C (68-77°F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its

operating temperature (room temperature) of 20-25°C (68-77°F), therefore no warming time is required before use.

Transportation

This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground

or air will not impact this product’s stated shelf life.

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