Recommended Profile

Reflow profile for Sn42/Bi57.6/Ag0.4 solder assembly, designed as a starting point for process optimization.

Test Results

Test J-STD-004 or other

requirements as stated

Test Requirement

Result

Copper Mirror

IPC-TM-650: 2.3.32

L: No breakthrough

Corrosion

IPC-TM-650: 2.6.15

L: No corrosion

Quantitative Halides

IPC-TM-650: 2.3.28.1

L: <0.05%

Electrochemical Migration

IPC-TM-650: 2.6.14.1

L: <1 decade drop (No-clean)

Surface Insulation Resistance 85°C,

85% RH @ 168 Hours

IPC-TM-650: 2.6.3.7

L: ≥100MΩ (No-clean)

Tack Value

IPC-TM-650: 2.4.44

33g

Viscosity – Malcom @ 10 RPM/25°C

(x103mPa/s)

IPC-TM-650: 2.4.34.4

Print: 140-195, Dispense: 115-160

Visual

IPC-TM-650: 3.4.2.5

Clear and free from precipitation

Conflict Minerals Compliance

Electronic Industry Citizenship

Coalition (EICC)

Compliant

REACH Compliance

Articles 33 and 67 of Regulation (EC)

No 1907/2006

Contains no substance >0.1% w/w that

is listed as a SVHC or restricted for

use in solder materials

Conforms to the following Industry Standards:

J-STD-004B, Amendment 1 (Solder Fluxes):

Yes

J-STD-005A (Solder Pastes):

Yes

J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):

Yes

RoHS 2 Directive 2011/65/EU:

Yes

2

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165°C (329°F)

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