Conclusion:

DS1963S

The following qualification successfully meets the quality and reliability standards required of all Dallas

Semiconductor products and processes:

Module Description:

A description of this Module can be found in the product data sheet. You can find the product data

sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.*

Reliability Derating:

A module device consists of one or more IC's in a single, upward integrated, package. This

package is assembled to include batteries, crystals, and other piece parts that make up the

configuration of the Module. Because of either the complexity of the package or the included piece

parts, standard high temperature reliability testing is not possible. Therefore, in order to determine

the reliability of module products, the reliability of each of the piece parts is individually determined,

then summed to determine the reliability of the integrated module product. If there are "n" significant

components in the module then:

Fr (module) = Fr (1) + Fr (2) + Fr (3) + ..... + Fr (n)

Fr (module) = Failure rate of module

Fr(n) = Failure rate of the nth component

Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate

is related to MTTF by:

MTTF = 1/Fr

NOTE: MTTF is frequently used interchangeably with MTBF.

The calculated failure rate for this module/assembly is:

The parameters used to calculate the module failure rate are as follows:

Cf: 60%

Ea: 0.7

B: 0

Tu: 25

Vu: 5.5

°C

Volts

In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing

product will continue to meet Maxim's quality and reliability standards. The current status of the

reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html.*

Module Device:

Quantity:

MTTF (Yrs):

FITs:

5.6

20404

DS2421

1

6

20404

Totals: