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AP3N10CI Datasheet(PDF) 2 Page - A POWER MICROELECTRONICS

Part # AP3N10CI
Description  100V N-Channel Enhancement Mode MOSFET
PDF  7 Pages
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Manufacturer  APME [A POWER MICROELECTRONICS]
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AP3N10CI Datasheet(HTML) 2 Page - A POWER MICROELECTRONICS

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AP3N10CI
100V N-Channel Enhancement Mode MOSFET
AP3N10CI REV1.1
永源微電子科技有限公司
Electrical Characteristics (TJ=25℃, unless otherwise noted)
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Units
V(BR)DSS
Drain-Source Breakdown Voltage
VGS=0V, ID=250μA
100
-
-
V
IDSS
Zero Gate Voltage Drain Current
VDS=100V, VGS=0V
-
-
1.0
μA
IGSS
Gate to Body Leakage Current
VDS=0V, VGS=±20V
-
-
±100
nA
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250μA
1.0
1.5
2.2
V
RDS(on)
Static Drain-Source on-Resistance
note2
VGS=10V, ID=2A
-
220
300
mΩ
VGS=4.5V, ID=1A
-
250
320
Ciss
Input Capacitance
VDS=25V, VGS=0V,
f=1.0MHz
-
321
-
pF
Coss
Output Capacitance
-
21
-
pF
Crss
Reverse Transfer Capacitance
-
15
-
pF
Qg
Total Gate Charge
VDS=30V, ID=2A,
VGS=10V
-
5.3
-
nC
Qgs
Gate-Source Charge
-
1.3
-
nC
Qgd
Gate-Drain(“Miller”) Charge
-
1.7
-
nC
td(on)
Turn-on Delay Time
VDS=30V,
ID=1A, RGEN=3Ω,
VGS=10V
-
14
-
ns
tr
Turn-on Rise Time
-
54
-
ns
td(off)
Turn-off Delay Time
-
18
-
ns
tf
Turn-off Fall Time
-
11
-
ns
IS
Maximum Continuous Drain to Source Diode Forward Current
-
-
2.2
A
ISM
Maximum Pulsed Drain to Source Diode Forward Current
-
-
8.8
A
VSD
Drain to Source Diode Forward Voltage
VGS=0V, IS=2.2A
-
-
1.2
V
Note :
1、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2、The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3、The power dissipation is limited by 150℃ junction temperature
4、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.



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