Pin Description

Pin Name

I/O

Options

Description

PA0~PA7

I/O

Pull-high*

Wake-up

Schmitt trigger

Input

Bidirectional 8-bit input/output port. Each pin can be configured as a

wake-up input by options. Software instructions determine the CMOS output

or Schmitt trigger input with pull-high resistor (determined by pull-high options).

PB0/BZ

PB1/BZ

PB2~PB7

I/O

Pull-high*

PB0 or BZ

PB1 or BZ

Bidirectional 8-bit input/output port. Software instructions determine the

CMOS output or Schmitt trigger input with pull-high resistor (determined by

pull-high options).

The PB0 and PB1 are pin-shared with BZ and BZ, respectively. Once the

PB0 or PB1 is selected as buzzer driving outputs, the output signals come

from an internal PFD generator (shared with timer/event counter).

VSS

¾¾

Negative power supply, ground

PC0/INT

PC1/TMR

PC2

I/O

Pull-high*

Bidirectional I/O lines. Software instructions determine the CMOS output or

Schmitt trigger input with pull-high resistor (determined by 1-bit pull-high op-

tions). The external interrupt and timer input are pin-shared with PC0 and

PC1, respectively. The external interrupt input is activated on a high to low

transition.

RES

I

¾

Schmitt trigger reset input. Active low.

VDD

¾¾

Positive power supply

OSC1

OSC2

I

O

Crystal or RC

OSC1and OSC2 are connected to an RC network or Crystal (determined by

options) for the internal system clock. In the case of RC operation, OSC2 is

the output terminal for 1/4 system clock.

Note:

²*² All pull-high resistors are controlled by an option bit.

Absolute Maximum Ratings

Storage Temperature ............................

-50°Cto125°C

Operating Temperature...........................

-40°Cto85°C

-100mA

Total Power Dissipation .....................................500mW

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

D.C. Characteristics

Ta=25

°C

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Conditions

Operating Voltage

¾

2.2

¾

5.5

V

¾

3.3

¾

5.5

V

Operating Current (Crystal OSC)

3V

¾

0.6

1.5

mA

5V

¾

24

mA

Operating Current (RC OSC)

3V

¾

0.8

1.5

mA

5V

¾

2.5

4

mA

Operating Current

(Crystal OSC, RC OSC)

5V

¾

48

mA

HT48E10

Rev. 1.50

3

October 31, 2006