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PACKAGE OUTLINE

15.1

14.9

14.1

13.9

1.15 MAX

0.333

0.155

573X

0.36

0.26

13 TYP

14 TYP

0.5 TYP

0.5 TYP

(0.5)

(0.5)

FCCSP - 1.15 mm max height

APE0573A

PLASTIC BALL GRID ARRAY

4231533/B 12/2025

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.

4. Dimension is measured at the maximum solder ball diameter, post reflow, parallel to primary datum C.

NOTE 4

BALL A1

CORNER

0.1 C

0.08 C

SEATING PLANE

0.2 C

NOTE 3

0.15

C A B

0.05

C

SYMM

SYMM

1

A

2

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

V

W

Y

AA

AB

AC

AD

AE

3

4 5

6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

AF

AG

26 27 28 29

SCALE 1.200

A

B

C