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STM32F101X4 Datasheet(PDF) 51 Page - STMicroelectronics

Part # STM32F101X4
Description  Low-density access line, ARM®-based 32 bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces
PDF  87 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F101X4 Datasheet(HTML) 51 Page - STMicroelectronics

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STM32F101x4, STM32F101x6
Electrical characteristics
86
5.3.11
Absolute maximum ratings (electrical sensitivity)
Based on three different tests (ESD, LU) using specific measurement methods, the device is
stressed in order to determine its performance in terms of electrical sensitivity.
Electrostatic discharge (ESD)
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are
applied to the pins of each sample according to each pin combination. The sample size
depends on the number of supply pins in the device (3 parts × (n+1) supply pins). This test
conforms to the JESD22-A114/C101 standard.
Static latch-up
Two complementary static tests are required on six parts to assess the latch-up
performance:
A supply overvoltage is applied to each power supply pin
A current injection is applied to each input, output and configurable I/O pin
These tests are compliant with EIA/JESD 78 IC latch-up standard.
5.3.12
I/O current injection characteristics
As a general rule, current injection to the I/O pins, due to external voltage below VSS or
above VDD (for standard, 3 V-capable I/O pins) should be avoided during normal product
operation. However, in order to give an indication of the robustness of the microcontroller in
cases when abnormal injection accidentally happens, susceptibility tests are performed on a
sample basis during device characterization.
Functional susceptibilty to I/O current injection
While a simple application is executed on the device, the device is stressed by injecting
current into the I/O pins programmed in floating input mode. While current is injected into
the I/O pin, one at a time, the device is checked for functional failures.
Table 30. ESD absolute maximum ratings
Symbol
Ratings
Conditions
Class
Maximum
value(1)
1. Based on characterization results, not tested in production.
Unit
VESD(HBM)
Electrostatic discharge
voltage (human body model)
TA = +25 °C
conforming to JESD22-A114
2
2000
V
VESD(CDM)
Electrostatic discharge
voltage (charge device model)
TA = +25 °C
conforming to
ANSI/ESD STM5.3.1
II
500
Table 31. Electrical sensitivities
Symbol
Parameter
Conditions
Class
LU
Static latch-up class
TA = +85 °C conforming to JESD78A
II level A



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