Rev06

– 2005/09

19

SEOUL SEMICONDUCTOR CO., LTD.

148-29, Kasan-Dong, Keumchun-Gu, Seoul, Korea

TEL : 82-2-3281-6269

FAX : 82-2-857-5430

20. Soldering Profile

(1) Reflow Soldering Conditions / Profile

Pre-heating

200

180

150

0

Temp

[°C]

220

240

260

Rising

5 °C/sec

Cooling

-5 °C/sec

Time

[Hr]

Tm : Reflow machine setting temp

Ts : Surface temp of PCB (max)

Ts : Surface temp of PCB (recommend)

Ts : Surface temp of PCB (min)

(2)

Hand Soldering conditions

- Lead : Not more than 3 seconds @MAX280℃

- Slug : Use a thermal-adhesives

* Caution

1. Reflow soldering should not be done more than one time.

2. Repairing should not be done after the LEDs have been soldered. When repairing is

unavoidable, suitable tools have to be used.

3. Die slug is to be soldered.

4. When soldering, do not put stress on the LEDs during heating.

5. After soldering, do not warp the circuit board.

6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.