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DEVICE INFORMATION

TERMINAL ASSIGNMENT

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PGND

PWM_F

GVDD_DEF

VDD

PWM_E

PWM_D

RESET

M3

M2

M1

GND

AGND

VREG

OC_ADJ

SD

OTW

PWM_C

PWM_B

PWM_A

GVDD_ABC

BST_BIAS

OUT_BIAS

BST_F

PVDD_F

OUT_F

PGND

OUT_E

PVDD_E

BST_E

BST_D

PVDD_D

OUT_D

PGND

PGND

OUT_C

PVDD_C

BST_C

BST_B

PVDD_B

OUT_B

PGND

OUT_A

PVDD_A

BST_A

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P0016-02

TAS5176

SLES196 – JUNE 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

The TAS5176 is available in a thermally enhanced 44-pin HTSSOP PowerPAD™ package. The heat slug is

located on the bottom side of the device for convenient thermal coupling to the printed circuit board which is

used as the heatsink for this device.

DDW PACKAGE

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