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AMC0200RDR Datasheet(PDF) 33 Page - Texas Instruments |
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AMC0200RDR Datasheet(HTML) 33 Page - Texas Instruments |
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33 / 37 page ![]() 8.4 Power Supply Recommendations In a typical application, the high-side power supply (VDD1) for the AMC0x00R is generated from the low-side supply (VDD2) by an isolated DC/DC converter. A low-cost option is based on the push-pull driver SN6501 and a transformer that supports the desired isolation voltage ratings. The AMC0x00R does not require any specific power-up sequencing. The high-side power supply (VDD1) is decoupled with a low-ESR, 100nF capacitor (C1) parallel to a low-ESR, 1μF capacitor (C2). The low-side power supply (VDD2) is equally decoupled with a low-ESR, 100nF capacitor (C3) parallel to a low-ESR, 1μF capacitor (C4). Place all four capacitors (C1, C2, C3, and C4) as close to the device as possible. Figure 8-6 shows a decoupling diagram for the AMC0x00R. C8 100nF Reference voltage R2 10 R1 10 C5 10nF AVDD C2 1µF C1 100nF C6 1nF C7 1nF I VDD1 GND1 INP INN to ADC VDD2 VDD2 OUT REFIN GND2 C4 1µF C3 100nF Figure 8-6. Decoupling of the AMC0x00R Verify capacitors provide adequate effective capacitance under the applicable DC bias conditions experienced in the application. Multilayer ceramic capacitors (MLCC) typically exhibit only a fraction of the nominal capacitance under real-world conditions. Consider this factor when selecting these capacitors. This issue is especially acute in low-profile capacitors, where the dielectric field strength is higher than in taller components. Reputable capacitor manufacturers provide capacitance versus DC bias curves that greatly simplify component selection. 8.5 Layout 8.5.1 Layout Guidelines The Layout Example section details a layout recommendation with the critical placement of the decoupling capacitors (as close as possible to the AMC0x00R supply pins). This example also depicts the placement of other components required by the device. 8.5.2 Layout Example Figure 8-7. Recommended Layout of the AMC0x00R Top Metal Inner or Bottom Layer Metal Via GND1 VDD1 C7 R2 C6 R1 C2 C1 Clearance area, keep free of any conductive materials GND2 VDD2 C3 C4 REFIN OUT to ADC from MCU or external reference INP INN www.ti.com AMC0300R, AMC0200R SBASAR9A – DECEMBER 2025 – REVISED JUNE 2026 Copyright © 2026 Texas Instruments Incorporated Submit Document Feedback 33 Product Folder Links: AMC0300R AMC0200R |
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