ST72681SLASHR21 datasheet(29/32 Pages) STMICROELECTRONICS

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ST72681

Package mechanical data

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 21.

48-pin low profile quad flat package outline

Table 27.

48-pin low profile quad flat package dimensions

Dim.

inches(1)

Values in inches are converted from mm and rounded to 3 decimal digits.

Min.

Typ.

Max.

Min.

Typ.

Max.

1.60

0.063

0.05

0.15

0.002

0.006

1.35

1.40

1.45

0.053

0.055

0.057

0.17

0.22

0.27

0.007

0.009

0.011

0.09

0.20

0.004

0.008

9.00

0.354

7.00

0.276

9.00

0.354

7.00

0.276

0.50

0.020

0°

3.5°

7°

0°

3.5°

7°

0.45

0.60

0.75

0.018

0.024

0.030

1.00

0.039

Number of Pins

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