RNBD350 datasheet(40/56 Pages) MICROCHIP

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RNBD350

Physical Dimensions and Attributes

Data Sheet

DS70005561C - 40

Table 6-2. RNBD350 Module Approved External Antenna List with Antenna Gain (continued)

Antenna

Number

Part Number

Manufacturer

Antenna

Gain (dBi)

Antenna

Type

Comment

RFA-02-P33-D034

Alead

PCB

150 mm

ABAR1504-S2450

ABRACON

2.28

PCB

250 mm

WBZ350 LGA

—

2.9

PCB

only for WBZ350 and

RNBD350 module

Notes:

1. If the end product using the module is designed to have an antenna port that is accessible to the end user, a unique

(non-standard) antenna connector (as permissible by FCC) must be used (for example, RP (Reverse Polarity)-SMA

socket).

2. If an RF coaxial cable is used between the module RF output and the enclosure, a unique (non-standard) antenna

connector must be used in the enclosure wall to interface with the antenna.

3. Contact the antenna vendor for detailed antenna specifications to review the suitability to the end product operating

environment and to identify alternatives.

4. If any external antenna is used other than the recommended antennas in the list, it may need an extra step of

post-calibration on the customer's application board.

6.6.

RNBD350 Module Reflow Profile Information

The RNBD350 Module was assembled using the IPC/JEDEC J-STD-020 standard lead-free reflow

profile. The RNBD350 Module can be soldered to the host board using standard leaded or lead-free

solder reflow profiles. To avoid damaging the module, adhere to the following recommendations:

• For solder reflow recommendations, refer to the AN233 Solder Reflow Recommendation Application

Note (DS00233).

• Do not exceed a peak temperature (TP) of 250°C.

• For specific reflow profile recommendations from the vendor, refer to the Solder Paste Data Sheet.

• Use no-clean flux solder paste.

• Do not wash as moisture can be trapped under the shield.

• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

6.6.1.

Cleaning

The exposed GND pad helps to self-align the module, avoiding pad misalignment. The

recommendation is to use the no clean solder pastes. Ensure full drying of no-clean paste fluxes as

a result of the reflow process. As per the recommendation by the solder paste vendor, this requires

longer reflow profiles and/or peak temperatures toward the high end of the process window. The

uncured flux residues can lead to corrosion and/or shorting in accelerated testing and possibly the

field.

6.7.

RNBD350 Module Assembly Considerations

The RNBD350 module is assembled with an EMI shield to ensure compliance with EMI emission and

immunity rules. The EMI shield is made of a tin-plated steel (SPTE) and is not hermetically sealed.

Use the solutions such as IPA and similar solvents to clean this module. The user must never use

cleaning solutions containing acid on the module.

6.7.1.

Conformal Coating

The modules are not intended for use with a conformal coating, and the customer assumes all risks

(such as the module reliability, performance degradation and so on) if a conformal coating is applied

to the modules.

RNBD350 Datasheet(PDF) 40 Page - Microchip Technology

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