LB A673

DATASHEET

DATASHEET

13 | Version 1.6 | 2022-08-03

Recommended Solder Pad 9)

3.7 (0.146)

1.2 (0.047)

Cu-area > 16 mm

Cu-Fläche > 16 mm

Paddesign

for improved

heat dissipation

Wärmeableitung

für verbesserte

Padgeometrie

Lötstopplack

Solder resist

OHLPY965

2

2

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not

suitable for ultra sonic cleaning.