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J176 Datasheet(PDF) 2 Page - InterFET Corporation

Part # J176
Description  P-Channel JFET
PDF  7 Pages
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Manufacturer  INTERFET [InterFET Corporation]
Direct Link  http://www.interfet.com
Logo INTERFET - InterFET Corporation

J176 Datasheet(HTML) 2 Page - InterFET Corporation

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https://www.InterFET.com
InterFET Corporation
November, 2023
InterFET
Product
Folder
Technical
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J176-7
Document Number: IF35089 Rev A01
J176-7
Electrical Characteristics
Static Characteristics (@ TA = 25°C, Unless otherwise specified)
Parameters
Conditions
J176
J177
Unit
Min
Max
Min
Max
V(BR)GSS
Gate to Source
Breakdown Voltage
VDS = 0V, IG = 1μA
30
30
V
IGSS
Gate to Source
Reverse Current
VGS = 20V, VDS = 0V
1
1
nA
VGS(OFF)
Gate to Source
Cutoff Voltage
VDS = -15V, ID = -10nA
1
4
0.8
2.25
V
IDSS
Drain to Source
Saturation Current
VGS = 0V, VDS = -15V
(Pulsed)
-2
-35
-1.5
-20
mA
ID(OFF)
Drain Cutoff Current
VDS = -15V, VGS = 10V
-1
-1
nA
Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified)
Parameters
Conditions
J176
J177
Unit
Min
Max
Min
Max
RDS(ON)
Drain to Source
ON Resistance
VDS <= 0.1V, VGS = 0V, f = 1kHz
250
300
Ω
Cgd
Drain Gate
Capacitance
VDS = 0V, VGS = 10V, f = 1MHz
5.5 (typ)
5.5 (typ)
pF
Cgs
Input Capacitance
VDS = 0V, VGS = 10V, f = 1MHz
5.5 (typ)
5.5 (typ)
pF
Cgd + Cgs
Drain + Source Gate
Capacitance
VDS = VGS = 0V, f = 1MHz
32 (typ)
32 (typ)
pF
td(ON)
Turn ON Delay Time
VDD = -6V
J176: VGS(OFF) = 6V, RL = 5600 Ω
J177: VGS(OFF) = 3V, RL = 10000 Ω
15 (typ)
20 (typ)
ns
tr
Rise Time
20 (typ)
25 (typ)
ns
td(OFF)
Turn OFF Delay Time
15 (typ)
20 (typ)
ns
tf
Fall Time
20 (typ)
25 (typ)
ns
Maximum Ratings (@ T
A
= 25°C, Unless otherwise specified)
Parameters
SOT-23
TO-92
Unit
VRGS Reverse Gate Source and Gate Drain Voltage
-20
-20
V
IFG
Continuous Forward Gate Current
50
50
mA
PD
Continuous Device Power Dissipation¹
350
500
mW
P
Power Derating1
2.8
4
mW/°C
TJ
Operating Junction Temperature
-55 to 150
-55 to 150
°C
TSTG Storage Temperature
-55 to 150
-55 to 150
°C
1 Thermal power dissipation and derating values obtained with gate pin (substrate) thermally connected to pad and/or internal layer.



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