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PACKAGE DISSIPATION RATINGS

(1)

RECOMMENDED OPERATING CONDITIONS

THS6182

SLLS544H – SEPTEMBER 2002 – REVISED JUNE 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

PRODUCT

PACKAGE CODE

SYMBOL

ORDER NUMBER

TRANSPORT MEDIA

Tape and reel

THS6182RHFR

(3000 devices)

Leadless 24-pin

THS6182RHF

RHF-24

6182

4, mm x 5, mm PowerPAD™

Tape and reel

THS6182RHFT

(250 devices)

THS6182D

Tube (40 devices)

THS6182D

SOIC-16

D-16

THS6182

Tape and reel

THS6832DR

(2500 devices)

THS6182DW

Tube (25 devices)

THS6182DW

SOIC-20

DW-20

THS6182

Tape and reel

THS6182DWR

(2000 devices)

THS6182DWP

Tube (25 devices)

THS6182DWP

SOIC-20 PowerPAD

DWP-20

THS6182

Tape and reel

THS6182DWPR

(2000 devices)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

PACKAGE

θ

JC

θ

JA

θ

JC

32

°C/W

74

°C/W

1.7

°C/W

D-16

--

62.9

°C/W

25.7

°C/W

DW-20

--

45.4

°C/W

16.4

°C/W

21.5

°C/W

43.9

°C/W

0.37

°C/W

(1)

θ

(2)

For high-power dissipation applications, use of the PowerPAD package with the PowerPad on the underside of the chip. This acts as a

heatsink and must be connected to a thermally dissipating plane for proper dissipation. Failure to do so may result in exceeding the

maximum junction temperature which could permanently damage and/or reduce the lifetime the device. See TI technical brief SLMA002

for more information about utilizing the PowerPAD thermally enhanced package.

(3)

Use of packages without the PowerPAD or not soldering the PowerPAD to the PCB, should be limited to low-power dissipation

applications.

MIN NOM MAX UNIT

Dual supply

±5

±12

±15

Supply voltage

V

Single supply

10

24

30

2

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