MP03XXX360

7/8

www.dynexsemi.com

PACKAGE DETAILS

For further package information, please contact Customer Services. All dimensions in mm, unless stated otherwise.

DO NOT SCALE.

MOUNTING RECOMMENDATIONS

Adequate heatsinking is required to maintain the base

dissipation may be calculated by use of V

in accordance with standard formulae. We can provide

assistance with calculations or choice of heatsink if required.

The heatsink surface must be smooth and flat; a surface finish

of N6 (32

µin) and a flatness within 0.05mm (0.002") are

recommended.

Immediately prior to mounting, the heatsink surface should be

lightly scrubbed with fine emery, Scotch Brite or a mild chemical

etchant and then cleaned with a solvent to remove oxide build

up and foreign material. Care should be taken to ensure no

foreign particles remain.

An even coating of thermal compound (eg. Unial) should be

applied to both the heatsink and module mounting surfaces.

This should ideally be 0.05mm (0.002") per surface to ensure

optimum thermal performance.

After application of thermal compound, place the module

squarely over the mounting holes, (or ‘T’ slots) in the heatsink.

Fit and finger tighten the recommended fixing bolts at each end.

Using a torque wrench, continue to tighten the fixing bolts by

rotating each bolt in turn no more than 1/4 of a revolution at a

time, until the required torque of 6Nm (55lbs.ins) is reached on

all bolts at both ends.

It is not acceptable to fully tighten one fixing bolt before starting

to tighten the others. Such action may DAMAGE the module.

35

28.5

80

115

92

3x M8

Ø5.5

2.8x0.8

42.5

5

1

2

3

Recommended fixings for mounting: M5 socket head cap screws.

Nominal weight: 950g

Auxiliary gate/cathode leads are not supplied but may be purchsed separately.

Module outline type code: MP03

12

3

K

G

12

3

Circuit type: HBN

Circuit type: HBT

Circuit type: HBP

G

12

3

K