LO-T66F datasheet(14/23 Pages) AMSOSRAM

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LO-T66F Datasheet(PDF) 14 Page - ams-OSRAM AG

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LO T66F

DATASHEET

14 | Version 1.1 | 2024-12-13

Recommended Solder Pad 9)

OHLPY970

2.6 (0.102)

Cu-area > 16 mm

Cu-Fläche > 16 mm

Solder resist

Lötstopplack

2.6 (0.102)

Padgeometrie für

improved heat dissipation

verbesserte Wärmeableitung

Paddesign for

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not

suitable for ultra sonic cleaning.

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