CHA3023

1-18GHz Wide Band Amplifier

DSCHA30235263 - 20 sep 05

8/8

Specifications subject to change without notice

Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE

Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

Bonding pad positions

Chip Thickness: 100um

Chipsize: 2150X1420

±35 µm

Ordering Information

Die form :

CHA3023-99F/00

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S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of

patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications

mentioned in this publication are subject to change without notice. This publication supersedes and replaces all

information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use

as critical components in life support devices or systems without express written approval from United Monolithic

Semiconductors S.A.S.