B32671L datasheet(30/39 Pages) EPCOS

30 / 39 page

1.2

Resistance to soldering heat

Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1.

Conditions:

Series

Solder bath temperature Soldering time

MKT boxed (except 2.5

× 6.5 × 7.2 mm)

coated

uncoated (lead spacing >10 mm)

260

±5 °C

±1s

MFP

MKP (lead spacing >7.5 mm)

MKT boxed (case 2.5

× 6.5 × 7.2 mm)

±1s

MKP

MKT

(lead spacing

≤7.5 mm)

uncoated (lead spacing

≤10 mm)

insulated (B32559)

<4 s

recommended soldering

profile for MKT uncoated

(lead spacing

≤ 10 mm) and

insulated (B32559)

Immersion depth

2.0 +0/ 0.5 mm from capacitor body or seating plane

Shield

Heat-absorbing board, (1.5

±0.5) mm thick, between

capacitor body and liquid solder

Evaluation criteria:

Visual inspection

No visible damage

ΔC/C

2% for MKT/MKP/MFP

5% for EMI suppression capacitors

tan

As specified in sectional specification

B32671L, B32672L

High V AC, high temperature (wound)

Page 30 of 39

Please read Cautions and warnings and

Important notes at the end of this document.

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