74LVC1G07

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© NXP Semiconductors N.V. 2016. All rights reserved.

Product data sheet

Rev. 12 — 28 November 2016

2 of 18

NXP Semiconductors

74LVC1G07

Buffer with open-drain output

3.

Ordering information

4.

Marking

[1]

The pin 1 indicator is located on the lower left corner of the device, below the marking code.

5.

Functional diagram

Table 1.

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74LVC1G07GW

40 C to +125 C

TSSOP5

plastic thin shrink small outline package; 5 leads;

body width 1.25 mm

SOT353-1

74LVC1G07GV

40 C to +125 C

SC-74A

plastic surface-mounted package; 5 leads

SOT753

74LVC1G07GM

40 C to +125 C

XSON6

plastic extremely thin small outline package;

no leads; 6 terminals; body 1

 1.45  0.5 mm

SOT886

74LVC1G07GF

40 C to +125 C

XSON6

plastic extremely thin small outline package;

no leads; 6 terminals; body 1

 1  0.5 mm

SOT891

74LVC1G07GN

40 C to +125 C

XSON6

extremely thin small outline package; no leads;

6 terminals; body 0.9

 1.0  0.35 mm

SOT1115

74LVC1G07GS

40 C to +125 C

XSON6

extremely thin small outline package; no leads;

6 terminals; body 1.0

 1.0  0.35 mm

SOT1202

74LVC1G07GX

40 C to +125 C

X2SON5

X2SON5: plastic thermal enhanced extremely thin

small outline package; no leads; 5 terminals;

body 0.8

 0.8  0.35 mm

SOT1226

Table 2.

Marking

Type number

Marking code[1]

74LVC1G07GW

VS

74LVC1G07GV

V07

74LVC1G07GM

VS

74LVC1G07GF

VS

74LVC1G07GN

VS

74LVC1G07GS

VS

74LVC1G07GX

VS

Fig 1.

Logic symbol

Fig 2.

IEC logic symbol

Fig 3.

Logic diagram