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(5) Soldering Conditions

· The LEDs can be soldered in place using the reflow soldering method.

Nichia cannot make a

guarantee on the LEDs after they have been assembled using the dip soldering method.

· Recommended soldering conditions

Reflow Soldering

Hand Soldering

Lead Solder

Lead-free Solder

Pre-heat

Pre-heat time

Peak

temperature

Soldering time

Condition

120

120 sec. Max.

240°C Max.

10 sec. Max.

refer to

Temperature - profile

180

120 sec. Max.

260°C Max.

10 sec. Max.

refer to

Temperature - profile

Temperature

Soldering time

350°C Max.

3 sec. Max.

(one time only)

Although the recommended soldering conditions are specified in the above table, reflow or hand

soldering at the lowest possible temperature is desirable for the LEDs.

A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.

[Temperature-profile (Surface of circuit board)]

Use the conditions shown to the under figure.

[Recommended soldering pad design]

Use the following conditions shown in the figure.

· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere

during air reflow.

It is recommended that the User use the nitrogen reflow method.

· The encapsulated material of the LEDs is silicone.

Therefore the LEDs have a soft surface on the

top of package.

The pressure to the top surface will be influence to the reliability of the LEDs.

Precautions should be taken to avoid the strong pressure on the encapsulated part.

So when using

the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.

· Repairing should not be done after the LEDs have been soldered.

When repairing is unavoidable,

a double-head soldering iron should be used.

It should be confirmed beforehand whether the

characteristics of the LEDs will or will not be damaged by repairing.

· Reflow soldering should not be done more than two times.

· When soldering, do not put stress on the LEDs during heating.

· After soldering, do not warp the circuit board.

(Unit : mm)

: Solder resist

4

4

9.5

1.5

1.5

<

<

120sec.Max.

Pre-heating

260°C Max.

10sec. Max.

60sec.Max.

Above 220°C

1 ~ 5°C / sec.

1 ~ 5°C / sec.

180 ~ 200°C

Pre-heating

240°C Max.

10sec. Max.

60sec.Max.

Above 200

°C

2.5 ~ 5°C / sec.

2.5 ~ 5°C / sec.

120 ~ 150°C

120sec.Max.

Nichia STS-DA1-0226

<Cat.No.080519>