PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

TPS78001DDCR

ACTIVE

SOT

DDC

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS78001DDCRG4

ACTIVE

SOT

DDC

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS78001DDCT

ACTIVE

SOT

DDC

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS78001DDCTG4

ACTIVE

SOT

DDC

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS78001DRVR

ACTIVE

SON

DRV

6

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TPS78001DRVRG4

ACTIVE

SON

DRV

6

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TPS78001DRVT

ACTIVE

SON

DRV

6

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TPS78001DRVTG4

ACTIVE

SON

DRV

6

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TPS780270200DDCR

PREVIEW

SOT

DDC

5

3000

TBD

Call TI

Call TI

TPS780270200DDCT

PREVIEW

SOT

DDC

5

250

TBD

Call TI

Call TI

TPS780330220DDCR

ACTIVE

SOT

DDC

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS780330220DDCRG4

ACTIVE

SOT

DDC

5

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS780330220DDCT

ACTIVE

SOT

DDC

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS780330220DDCTG4

ACTIVE

SOT

DDC

5

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

TPS780330220DRVR

ACTIVE

SON

DRV

6

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TPS780330220DRVRG4

ACTIVE

SON

DRV

6

3000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TPS780330220DRVT

ACTIVE

SON

DRV

6

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

TPS780330220DRVTG4

ACTIVE

SON

DRV

6

250

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

PACKAGE OPTION ADDENDUM

www.ti.com

5-Aug-2008

Addendum-Page 1