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AD5024 Datasheet(PDF) 21 Page - Analog Devices

Part # AD5024
Description  Fully Accurate, 12-/14-/16-Bit VOUT nanoDAC, Quad, SPI Interface, 4.5 V to 5.5 V in TSSOP
PDF  28 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD5024 Datasheet(HTML) 21 Page - Analog Devices

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AD5024/AD5044/AD5064
Rev. 0 | Page 21 of 28
CLEAR CODE REGISTER
The AD5024/AD5044/AD5064 have a hardware CLR pin that
is an asynchronous clear input. The CLR input is falling edge
sensitive. Bringing the CLR line low clears the contents of the
input register and the DAC registers to the data contained in
the user-configurable CLR register and sets the analog outputs
accordingly (see
). This function can be used in system
calibration to load zero scale, midscale, or full scale to all channels
together. Note that zero scale and full scale are outside the linear
region of the DAC. These clear code values are user-programmable
by setting two bits, Bit DB1 and Bit DB0, in the control register
(see
). The default setting clears the outputs to 0 V.
Command 0101 is designated for loading the clear code register
(see
).
Table 11
Table 11
Table 7
The part exits clear code mode on the 32nd falling edge of the
next write to the part. If CLR is activated during a write
sequence, the write is aborted.
The CLR pulse activation time, which is the falling edge of CLR
to when the output starts to change, is typically 10.6 μs. If outside
the DAC linear region, it typically takes 10.6 μs after executing
CLR for the output to start changing (see
).
Figure 33
See Table 12 for contents of the input shift register during the
loading clear code register operation.
LDAC FUNCTION
Hardware LDAC Pin
The outputs of all DACs can be updated simultaneously using
the hardware LDAC pin, as shown in
.
Figure 2
Synchronous LDAC: After new data is read, the DAC registers
are updated on the falling edge of the 32nd SCLK pulse. LDAC
can be permanently low or pulsed.
Asynchronous LDAC: The outputs are not updated at the same
time that the input registers are written to. When LDAC goes
low, the DAC registers are updated with the contents of the
input register.
Software LDAC Function
Alternatively, the outputs of all DACs can be updated simulta-
neously using the software LDAC function by writing to Input
Register n and updating all DAC registers. Command 0010 is
reserved for this software LDAC function.
The LDAC register gives the user extra flexibility and control
over the hardware LDAC pin (see
). Setting the
Table 14
LDAC
bit register (DB0 to DB3) to 0 for a DAC channel means that
this channel’s update is controlled by the hardware LDAC pin.
If this bit is set to 1, this channel updates synchronously; that is,
the DAC register is updated after new data is read, regardless of
the state of the hardware LDAC pin.
It effectively sees the hardware LDAC pin as being tied low.
(See
for the
Table 13
LDAC register mode of operation.) This
flexibility is useful in applications where the user wants to simul-
taneously update select channels while the rest of the channels
are synchronously updating.
Writing to the DAC using Command 0110 loads the 4-bit
LDAC register (DB3 to DB0). The default for each channel is 0;
that is, the LDAC pin works normally. Setting the bits to 1 means
that the DAC channel is updated regardless of the state of the
LDAC pin.
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the board.
The printed circuit board containing the AD5024/AD5044/
AD5064 should have separate analog and digital sections. If the
AD5024/AD5044/AD5064 is in a system where other devices
require an AGND-to-DGND connection, the connection should
be made at one point only. This ground point should be as close
as possible to the AD5024/AD5044/AD5064.
The power supply to the AD5024/AD5044/AD5064 should
be bypassed with 10 μF and 0.1 μF capacitors. The capacitors
should physically be as close as possible to the device, with the
0.1 μF capacitor ideally right up against the device. The 10 μF
capacitors are the tantalum bead type. It is important that the
0.1 μF capacitor have low effective series resistance (ESR) and
low effective series inductance (ESI), such as is typical of common
ceramic types of capacitors. This 0.1 μF capacitor provides a low
impedance path to ground for high frequencies caused by
transient currents due to internal logic switching.
The power supply line should have as large a trace as possible to
provide a low impedance path and reduce glitch effects on the
supply line. Clocks and other fast switching digital signals should
be shielded from other parts of the board by digital ground. Avoid
crossover of digital and analog signals, if possible. When traces
cross on opposite sides of the board, ensure that they run at right
angles to each other to reduce feedthrough effects through the
board. The best board layout technique is the microstrip tech-
nique, where the component side of the board is dedicated to the
ground plane only and the signal traces are placed on the solder
side. However, this is not always possible with a 2-layer board.



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