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STD2NM60 Datasheet(PDF) 3 Page - STMicroelectronics

Part # STD2NM60
Description  N-CHANNEL 600V - 2.8ohm - 2A DPAK/IPAK Zener-Protected MDmesh™ Power MOSFET
PDF  10 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STD2NM60 Datasheet(HTML) 3 Page - STMicroelectronics

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STD2NM60/STD2NM60-1
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
GATE-SOURCE ZENER DIODE
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components.
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
td(on)
tr
Turn-on Delay Time
Rise Time
VDD = 300V, ID = 1 A
RG = 4.7Ω VGS = 10V
(see test circuit, Figure 3)
13
8
ns
ns
Qg
Total Gate Charge
VDD = 480V, ID = 2 A,
VGS = 10V
6
8.4
nC
Qgs
Gate-Source Charge
1.8
nC
Qgd
Gate-Drain Charge
3.3
nC
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
tr(Voff)
Off-voltage Rise Time
VDD = 480 V, ID = 2 A,
RG =4.7Ω, VGS = 10V
(see test circuit, Figure 5)
12
ns
tf
Fall Time
25
ns
tc
Cross-over Time
30
ns
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
ISD
Source-drain Current
2
A
ISDM (2)
Source-drain Current (pulsed)
8
A
VSD (1)
Forward On Voltage
ISD = 2 A, VGS = 0
1.5
V
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
ISD = 2 A, di/dt = 100A/µs,
VDD = 100 V, Tj = 25°C
(see test circuit, Figure 5)
516
516
2
ns
nC
A
trr
Qrr
IRRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
ISD = 2 A, di/dt = 100A/µs,
VDD = 100 V, Tj = 150°C
(see test circuit, Figure 5)
808
890
2.2
ns
nC
A
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
BVGSO
Gate-Source Breakdown
Voltage
Igs=± 1mA (Open Drain)
30
V



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