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STD2NM60 Datasheet(PDF) 3 Page - STMicroelectronics |
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STD2NM60 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 10 page ![]() 3/10 STD2NM60/STD2NM60-1 ELECTRICAL CHARACTERISTICS (CONTINUED) SWITCHING ON SWITCHING OFF SOURCE DRAIN DIODE Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. GATE-SOURCE ZENER DIODE PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. Symbol Parameter Test Conditions Min. Typ. Max. Unit td(on) tr Turn-on Delay Time Rise Time VDD = 300V, ID = 1 A RG = 4.7Ω VGS = 10V (see test circuit, Figure 3) 13 8 ns ns Qg Total Gate Charge VDD = 480V, ID = 2 A, VGS = 10V 6 8.4 nC Qgs Gate-Source Charge 1.8 nC Qgd Gate-Drain Charge 3.3 nC Symbol Parameter Test Conditions Min. Typ. Max. Unit tr(Voff) Off-voltage Rise Time VDD = 480 V, ID = 2 A, RG =4.7Ω, VGS = 10V (see test circuit, Figure 5) 12 ns tf Fall Time 25 ns tc Cross-over Time 30 ns Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD Source-drain Current 2 A ISDM (2) Source-drain Current (pulsed) 8 A VSD (1) Forward On Voltage ISD = 2 A, VGS = 0 1.5 V trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 2 A, di/dt = 100A/µs, VDD = 100 V, Tj = 25°C (see test circuit, Figure 5) 516 516 2 ns nC A trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 2 A, di/dt = 100A/µs, VDD = 100 V, Tj = 150°C (see test circuit, Figure 5) 808 890 2.2 ns nC A Symbol Parameter Test Conditions Min. Typ. Max. Unit BVGSO Gate-Source Breakdown Voltage Igs=± 1mA (Open Drain) 30 V |
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